Chip Carrier Ceramic

Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.

Chip carrier ceramic.

12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf. The external lead frame is formed into a j shape to allow for socketing or direct board soldering. Ldcc leaded chip carrier ej leaded ceramic chip carrier package drawing ej. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as jedec.

The leadless chip carrier s low profile multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and bottom of the package. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering though sockets can be used for testing. Chip carriers may be made of ceramic or plastic. 1st 2nd 3rd total seal ring die attach a x b c x d e x.

Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications. Leadless chip carriers have metal pads on the edges. Clcc ceramic leadless chip carrier mm inch unit. Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Leaded chip carriers have metal leads wrapped around the edge of the package in the shape of a letter j. Leadless ceramic chip carrier with heat sink package drawing eh ep view more. Evergreen semiconductor materials esm is an independent distributor of ceramic ic packaging materials sockets esd protective packaging and silicon wafers. The leadless chip carrier s low profile and multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and on the bottom of the package.

Package outline material information. Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.